Reactive bonding

Results: 39



#Item
1Chemistry / Matter / Optical materials / Plastics / Dielectrics / Commodity chemicals / Thermoplastics / Adhesives / Poly / Cyanoacrylate / Thixotropy / Epoxy

REACTIVE ADHESIVES Important notice: The information about our products is the result of thoroughly conducted examinations. The information’s purpose is to help you with your bonding works to the best of our knowledge.

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Source URL: www.technicoll.eu

Language: English - Date: 2016-01-19 15:04:03
2

Reactive Bonding by Using Multi Nano Layer Systems 10 µm 200 nm

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Source URL: www.enas.fraunhofer.de

Language: English - Date: 2016-06-16 07:41:35
    3Behavior / Human behavior / Interpersonal relationships / Love / Psychoanalysis / Mary Ainsworth / Biological basis of love / Infant / Reactive attachment disorder / Attachment theory / Human development / Developmental psychology

    The ChildTrauma Academy www.ChildTrauma.org Bonding and Attachment in Maltreated Children Consequences of Emotional Neglect

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    Source URL: childtrauma.org

    Language: English - Date: 2013-11-18 16:03:30
    4Technology / Electronics manufacturing / Chemical bonding / Wafer bonding / Microelectromechanical systems / Deep reactive-ion etching / Wafer / Through-silicon via / EV Group / Semiconductor device fabrication / Materials science / Microtechnology

    FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto

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    Source URL: www.izm.fraunhofer.de

    Language: English - Date: 2013-01-18 04:24:22
    5Behavior / Human behavior / Interpersonal relationships / Love / Psychoanalysis / Mary Ainsworth / Biological basis of love / Infant / Reactive attachment disorder / Attachment theory / Human development / Developmental psychology

    The ChildTrauma Academy www.ChildTrauma.org Bonding and Attachment in Maltreated Children Consequences of Emotional Neglect

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    Source URL: childtrauma.org

    Language: English - Date: 2014-01-15 10:25:33
    6Materials science / Fraunhofer Society / Wafer bonding / Through-silicon via / Wafer / Deep reactive-ion etching / Semiconductor device fabrication / Microtechnology / Electronics

    FRAUNHOFER-INSTITUT FÜR ZUVERLÄSSIGKEIT UND MIKROINTEGRATION J OIN THE T EAM ! Job opportunities @ Fraunhofer IZM-ASSID in Dresden/Moritzburg WHO WE ARE:

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    Source URL: www.izm.fraunhofer.de

    Language: English - Date: 2015-04-08 14:28:22
    7Technology / Electronics manufacturing / Chemical bonding / Wafer bonding / Microelectromechanical systems / Deep reactive-ion etching / Wafer / Through-silicon via / EV Group / Semiconductor device fabrication / Materials science / Microtechnology

    FRAUNHOFER INSTITUTE FOR RELIABILITY AND MICROINTEGRATION IZM WAFER LEVEL MEMS PACKAGING 3D wafer level system integration is one sealed by bonding of a cap wafer onto

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    Source URL: www.izm.fraunhofer.de

    Language: English - Date: 2013-01-18 04:01:57
    8Semiconductor device fabrication / Electrical engineering / Mechanical engineering / Microelectromechanical systems / Transducers / Wafer bonding / Flip chip / Deep reactive-ion etching / Amkor Technology / Materials science / Technology / Microtechnology

    High Volume Assembly & Test Solutions To Meet The Rapidly Growing MEMS Market Russell Shumway Director- MEMS & Sensor Products Office:

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    Source URL: www.gsaglobal.org

    Language: English - Date: 2014-01-22 10:45:23
    9Bond-dissociation energy / Boron nitride / Crystal / Hydrogen bond / Bond energy / Chemical bond / Force field / Diborane / Bond length / Chemistry / Chemical bonding / Borazine

    THE JOURNAL OF CHEMICAL PHYSICS 123, 114703 共2005兲 The theoretical study on interaction of hydrogen with single-walled boron nitride nanotubes. I. The reactive force field ReaxFFHBN development Sang Soo Han, Jeung K

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    Source URL: authors.library.caltech.edu

    Language: English - Date: 2012-12-26 03:44:00
    10Technology / Microelectromechanical systems / Etching / Wafer / Microfabrication / Deep reactive-ion etching / Chemical-mechanical planarization / Thermal oxidation / Silicon on insulator / Semiconductor device fabrication / Materials science / Microtechnology

    A new low-temperature high-aspect-ratio MEMS process using plasma activated wafer bonding

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    Source URL: deepblue.lib.umich.edu

    Language: English - Date: 2013-09-17 15:11:17
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